Products
TGV Glass Core
.png)
Key Feature
LADY(Laser Arrow Decomposition Yield)
- Using laser via drilling and proprietary vapor-phase etching technologies, precise micro vertical vias are formed on glass substrates.
- This enables high aspect ratios and fine pitch structures.
- Achieving high microstructural accuracy while minimizing material damage and processing errors.
MAN(Micro Array Nanopin)
- Precision via-filling technology with nanoscale metal pin arrays supports high-density interconnection with 100% yield.
- Copper-filled vias form vertical interconnect structures that enhance electrical conductivity and mechanical stability.
- Supports high-speed signal transmission.
PRODUCT INFOMATION
- Product Description
-
TGV (Through Glass Via)
- Applications
-
Mini & Micro LED, 2.5 & 3D package for the semiconductor, MEMS, Bio Chips, 5G Chips
- Feature
-
Item Spec. Glass type alkali free glass Customized Glass Thickness 0.15um-1.0um Customized Via Diameter 10um-200um Customized Aspect Ratio 1:1-1:15 Customized Via Shapes Straight Customized Inside wall Free of microcracks, chipping & induced stress Via sife walls Ra <1um Substrate Size 50mm-180mm (Round/Square) Positional Accuracy of Via +/- 3um Pattern/Via contact material Silver Paste/Copper