Products
Wafer ReBirth®
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Vapor Etching and Decomposition Technology
Ingentec’s specialty gases not only sell to customers, we also develop other applications. After market survey, Research & Development Dept. develop Vapor Etching equipment and apply to the silicon wafer ReBirth® and glass drilling by using the etching, film removal and drilling characters of specialty gas.
ReBirth®
The major application is for silicon wafer film removal for semiconductor field, we call it as ReBirth®. The advantages of ReBirth® is extremely low chemical consumption can remove the film comply with customer specification to save the cost of customer and protect the environment.
TGV (Through Glass Via)
The major application is for glass drilling by using the small molecule of specialty gas to drill the glass for metal contact deposition. TGV is widely applied in Micro LED, 3D IC package, MEMS, Biotechnology IC and 5G IC. More application of Vapor Etching is under developed. .
PRODUCT INFOMATION
- Product Description
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Wafer ReBirth®
- Applications
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01
Etching various types of film semiconductor wafers and integrated circuits
02
8 inch –12 inch wafer ReBirth®
03
Various precision parts cleaning
- Feature
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01
Wafer ReBrith® is the best technology of stripping all films for in-house reclaim fabs, with eco-friendly chemical consumption.
02
Wafer ReBirth® can revive the scrap wafers and reduce the total wafer running cost for IC fabs.
03
Wafer ReBirth® is a state-of-the-art technology, and it will be the best partner for In-House Reclaim fabs.